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SELECTED WORK / PCB LAYOUT

Xilinx SOM + Carrier Board

PCB layout for a Xilinx-based system-on-module and carrier-board project. The SOM combines a compact 102 × 72 mm outline with a 12-layer, through-hole PCB construction.

Platform
Xilinx-based FPGA
SOM layer count
12 layers
SOM dimensions
102 × 72 mm
Design tool
Cadence Allegro 16.6
SOM via technology
Through-hole vias
Project interfaces
LPDDR3 · PCIe Gen 2 · USB 3.2

PCB layout scope

SOM core-board and carrier-board PCB layout. Layer count and dimensions above refer specifically to the SOM; carrier-board specifications are not listed.

Project imagery

Original layout views show component placement and multilayer routing detail. The assembly photograph has its background removed and project identifiers redacted; SoC markings are retained.

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