High-Speed Routing
- Differential pair routing
- Length and phase matching
- Controlled impedance
- Reference plane continuity
- Return path consideration
- Interface-specific routing constraints
CAPABILITIES / CONSTRAINT-DRIVEN LAYOUT
Built for Complex PCB Designs
Our layout workflow is designed for projects where routing density, signal integrity, power distribution, mechanical constraints and manufacturability must be considered together.
HIGH-SPEED INTERFACES
DDR / PCIe / USB / Ethernet / LVDS / MIPI / SerDes
HDI Technology
- Blind vias
- Buried vias
- Microvias
- Via-in-pad
- BGA escape routing
- Sequential HDI structures
Multilayer Design
- Complex PCB stackups
- Signal / power layer planning
- Power and ground planes
- High-density routing
- Mixed-signal partitioning
Manufacturing Readiness
- Design Rule Check (DRC)
- Design for Manufacturing (DFM) consideration
- Gerber generation
- ODB++ generation
- NC Drill
- Pick-and-place data
- Assembly documentation
POWER ELECTRONICS
Power, signal and thermal considerations.
Power distribution, power and ground plane planning, mixed-signal partitioning and thermal considerations are reviewed alongside routing and mechanical requirements. Stackup, copper and fabrication constraints are agreed for each project.
OUR CORE DESIGN PLATFORM
Cadence Allegro
PCB Layout Expertise
Cadence Allegro is at the core of our PCB layout workflow. We use Allegro for complex multilayer, high-speed and high-density PCB designs requiring precise constraint management and advanced routing capabilities.
Explore CapabilitiesCONSTRAINT-DRIVEN DESIGN
Cadence Allegro
01Complex PCB Layout
02High-Speed Routing
03HDI / BGA Design
04Manufacturing Outputs
LET’S BUILD YOUR NEXT BOARD
Have a PCB project to discuss?
Send us your schematic, design requirements or existing PCB files.