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CAPABILITIES / CONSTRAINT-DRIVEN LAYOUT

Built for Complex PCB Designs

Our layout workflow is designed for projects where routing density, signal integrity, power distribution, mechanical constraints and manufacturability must be considered together.

PCB LAYOUT PLATFORM EXPERIENCE

Layout experience across
processor & FPGA platforms.

Our PCB layout experience spans a wide range of processor and FPGA platforms. Representative examples include Intel, AMD, NVIDIA Jetson, Rockchip, HiSilicon, Xilinx-based FPGAs, Loongson, Zhaoxin and Phytium, among others.

  • Intel processor-based boards

  • AMD processor-based boards

  • Jetson Nano / NX / Orin

  • Rockchip processor-based boards

  • HiSilicon processor-based boards

  • Xilinx-based FPGA boards

  • Loongson processor-based boards

  • Zhaoxin processor-based boards

  • Phytium processor-based boards

Platform names and logos identify components used in past PCB layout projects. They do not imply a customer relationship, partnership or endorsement. All trademarks belong to their respective owners.

HIGH-SPEED INTERFACES

DDR / PCIe / USB / Ethernet / LVDS / MIPI / SerDes

01

High-Speed Routing

  • Differential pair routing
  • Length and phase matching
  • Controlled impedance
  • Reference plane continuity
  • Return path consideration
  • Interface-specific routing constraints
02

HDI Technology

  • Blind vias
  • Buried vias
  • Microvias
  • Via-in-pad
  • BGA escape routing
  • Sequential HDI structures
03

Multilayer Design

  • Complex PCB stackups
  • Signal / power layer planning
  • Power and ground planes
  • High-density routing
  • Mixed-signal partitioning
04

Manufacturing Readiness

  • Design Rule Check (DRC)
  • Design for Manufacturing (DFM) consideration
  • Gerber generation
  • ODB++ generation
  • NC Drill
  • Pick-and-place data
  • Assembly documentation

POWER ELECTRONICS

Power, signal and thermal considerations.

Power distribution, power and ground plane planning, mixed-signal partitioning and thermal considerations are reviewed alongside routing and mechanical requirements. Stackup, copper and fabrication constraints are agreed for each project.

OUR CORE DESIGN PLATFORM

Cadence Allegro
PCB Layout Expertise

Cadence Allegro is at the core of our PCB layout workflow. We use Allegro for complex multilayer, high-speed and high-density PCB designs requiring precise constraint management and advanced routing capabilities.

Explore Capabilities
CONSTRAINT-DRIVEN DESIGN

Cadence Allegro

01Complex PCB Layout
02High-Speed Routing
03HDI / BGA Design
04Manufacturing Outputs

LET’S BUILD YOUR NEXT BOARD

Have a PCB project to discuss?

Send us your schematic, design requirements or existing PCB files.

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