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SELECTED WORK / PCB LAYOUT

Rockchip RK3588 SOM + Carrier Board

PCB layout for a Rockchip RK3588-based SOM and carrier-board project. The 10-layer SOM uses through-hole vias within a compact 60 × 45 mm outline, integrating memory and a broad range of peripheral interfaces.

Selected SOM routing layer — red
Selected SOM routing layer — redDisplayed with client permission.
SOM component placement — top side
SOM component placement — top side
SOM component placement — bottom side
SOM component placement — bottom side
Selected SOM routing layer — amber
Selected SOM routing layer — amber
Selected SOM routing layer — purple
Selected SOM routing layer — purple
Power-area layout and routing detail
Power-area layout and routing detail
Assembled SOM and carrier board; customer identifiers redacted
Assembled SOM and carrier board; customer identifiers redacted
Platform
Rockchip RK3588
SOM layer count
10 layers
SOM dimensions
60 × 45 mm
Design tool
Cadence Allegro 17.2
SOM via technology
Through-hole vias
Project interfaces
USB 2.0 · USB 3.0 · PCIe 2.0 · MIPI · LPDDR4 · MDI · HDMI · DisplayPort · Ethernet PHY · SD · eMMC

PCB layout scope

SOM core-board and carrier-board PCB layout. Layer count and dimensions above refer specifically to the SOM; carrier-board specifications are not listed.

Project imagery

Original layout views show both sides of the SOM, selected routing layers and power-distribution views. The assembly photograph has its background removed and customer identifiers redacted; chip markings and component references are retained.

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