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SELECTED WORK / PCB LAYOUT

Intel Kaby Lake-G Industrial Motherboard

PCB layout for an Intel Kaby Lake-G-based industrial motherboard. The 8-layer, 410 × 210 mm board uses through-hole vias and a shaped board outline, with DDR4 memory and multiple peripheral interfaces.

Industrial motherboard component placement
Industrial motherboard component placementDisplayed with client permission.
Selected motherboard routing layer — amber
Selected motherboard routing layer — amber
Selected motherboard routing layer — purple
Selected motherboard routing layer — purple
DDR4 memory routing detail
DDR4 memory routing detail
Routing and length-tuning detail
Routing and length-tuning detail
Processor power-area layout detail
Processor power-area layout detail
Peripheral routing detail
Peripheral routing detail
Platform
Intel Kaby Lake-G
Layer count
8 layers
Board dimensions
410 × 210 mm
Design tool
Cadence Allegro 17.2
Via technology
Through-hole vias
Project interfaces
DDR4 SO-DIMM · PCIe Gen 3 · USB 3.0 · USB4 40 Gbps · eDP · DisplayPort · HDMI · SATA · LAN

PCB layout scope

PCB placement and routing for an industrial motherboard, covering processor and DDR4 memory routing, power-area layout and peripheral connections across a shaped board outline. The specifications above refer to the motherboard.

Project imagery

Seven original CAD views show component placement, selected routing layers, memory routing, routing detail, power-area layout and peripheral routing.

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